微軟Azure 運算雲端平台實現現代化晶片開發優勢

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愛的媒體朋友們:

去年十月份,我們首度參與台積電的雲端聯盟 Open Innovation Platform (OIP),也很榮幸獲頒台積電『2018 年度雲端最佳夥伴獎』,這個獎項不僅肯定了微軟在共同開發OIP VDE 雲端方案的努力,更激勵了我們持續在半導體領域深耕。藉由此次合作,我們盼有更多半導體業者可運用 Azure 運算雲端平台的能力實現現代化晶片開發的優勢。

半導體是台灣的經濟核心,每年貢獻15% GDP。當消費者對於終端裝置的期待日漸增高,同時國際大廠紛紛追求7奈米、甚至5奈米的先進製程,盼能提供更快速、低耗能的晶片與裝置。這更趨使國際大廠在記憶體需求上承受極大期待,越往先進製程發展,市場競爭也越見激烈。對於這個幾乎是贏者全拿的市場,最大的挑戰不外乎是產品上市的時間。但對於先進製程所需要的基礎設施,傳統地端的伺服器架構(Architecture)與規模(Scale)則很難支援如此大量的計算(Compute)與暫儲空間 (RAM)。

有鑑於此,微軟與合作夥伴日前分別在拉斯維加斯的Design Automation Conference以及Computex 2019上針對半導體與智慧製造高度需求的高速電腦運算(High Performance Computing),發表了HB/HC Series虛擬機器,探討如何利用HB系列虛擬機器與最新高速電腦運算服務,在19個小時內快速完成兩次7奈米製程的實體驗證,大幅縮短了IC 設計廠商的上市時間,相較我們過去的方法,新型態的驗證節省了一倍的時間成本,透過Azure的高效運算,大幅提升產能,供應商將能更迅速地回應客戶的要求。

這項突破性的技術也引起了國際科技性產業媒體的廣泛報導,以下附上相關報導給各位媒體朋友們參考,若有記者媒體希望能對此議題做更深入的專訪與分析,歡迎聯繫我們的公關團隊,將推薦適合的產品團隊同仁為您提供更多資訊與解答。

台灣微軟總經理  孫基康

 

內外相關新聞報導
iThomeMentor、AMD與微軟Azure和台積電攜手合作,在AMD EPYC處理器上以10小時內完成7奈米晶片的實體驗證

Inside HPCAMD透過Azure平台大幅縮短Vega20 GPU驗證

內容摘要:

Using TSMC 7nm Calibre design kits running in Azure, AMD successfully completed two verification passes in ~19 hours – a dramatic reduction in total physical verification turnaround time, despite the massive 13.2B transistors on the AMD design. In addition, AMD scaled Calibre nmDRC out to 4,140 cores across 69 HB virtual machines, enabling its engineers to balance tight deadlines against demanding resource requirements and other costs.

AMD demands speed and quality of execution in our cutting-edge semiconductor design work, so achieving two verification passes in one day in the cloud is critical to getting future designs to market,” said Daniel Bounds, senior director, AMD Datacenter Products. “AMD is pleased to see that Mentor’s Calibre nmDRC scales on cloud-based AMD EPYC-powered servers not just in traditional use models, but also on the Azure public cloud.”

With this latest achievement, Mentor has again demonstrated its value to the TSMC OIP ecosystem,” said Suk Lee, TSMC senior director, Design Infrastructure Management Division. “We’re pleased with this result of collaborative efforts combining TSMC’s process technology and design enablement with Mentor’s design platform and Microsoft Azure’s cloud service in achieving this notable milestone.”

Morningstar: Mentor透過Azure平台為半導體設計工作打造軟體工具延展新標竿

內容摘要:

“Calibre has set a new benchmark for EDA tool performance, scalability and efficient memory use – all metrics of increasingly critical importance as new semiconductor process nodes introduce unparalleled complexity and encourage ever-larger CPU runs,” said Mujtaba Hamid, head of Product Management, Silicon, Electronics and Gaming, Azure Engineering, Microsoft Corp. “Calibre supports the rapidly evolving requirements of our semiconductor customers, while demonstrating the outstanding security and performance that Microsoft Azure cloud offers to the demanding EDA market.”

Moneycontrol: Computex 2019AMD 宣布第三代Ryzen 3000 系列處理器( 售價、規格、上市時間)

Microsoft blog: Azure虛擬機器HB系列創下雲端超級運算里程碑

內容摘要:

HB-series VMs feature the cloud’s first deployment of AMD EPYC 7000-series CPUs explicitly for HPC customers. AMD EPYC features 33 percent more memory bandwidth than any x86 alternative, and even more than leading POWER and ARM server platforms. In context, the 263 GB/s of memory bandwidth the HB-series VM delivers is 80 percent more than competing cloud offerings in the same memory per core class.

HB-series VMs expose 60 non-hyperthreaded CPU cores and 240 GB of RAM, with a baseclock of 2.0 GHz, and an all-cores boost speed of 2.55 GHz. HB VMs also feature a 700 GB local NVMe SSD, and support up to four Managed Disks including the new Azure P60/P70/P80 Premium Disks.

A flagship feature of HB-series VMs is 100 GB/ss InfiniBand from Mellanox. HB-series VMs expose the Mellanox ConnectX-5 dedicated back-end NIC via SR-IOV, meaning customers can use the same OFED driver stack that they’re accustomed to in a bare metal context. HB-series VMs deliver MPI latencies as low as 2.1 microseconds, with consistency, bandwidth, and message rates in line with bare-metal InfiniBand deployments.

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